1. Motherboard Protection Design: The ball head design effectively prevents damage to the motherboard, ensuring safety during the soldering process. 2. Made from pure copper with gold plating, offering excellent conductivity and anti-oxidation properties. 3. Uniform Tin Coating: The tin-coating process is fast and uniform, ensuring consistent soldering quality. 4. Strong Compatibility: Compatible with various phone models, catering to a diverse range of user needs. 5. High Durability: Quality materials and design extend product lifespan, reducing frequency of replacement.
